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Diamond Lapping Paste, Slurries and Compound

DIANAMIC® is the sole distributor in the USA for Adamas Laboratory Diamond Compound, Diamond Slurries and Lapping Paste. Since 1938 Adamas has been supplying Diamond abrasives in the most exacting standards.

Particle Analysis

Each batch of micronized Diamond is tested and certified with a Grade Quality Certification using a proprietary Particle Analysis System that combines statistical and video analysis for exact evaluation. Test results by Lot Number are available on request to support your quality control measures such as ISO documentation requirements.

Available Compounds

Adamas compounds are available in three different carrying medias for varying applications:

  1. M-based compounds (oil soluble) have a wide thermal processing range of up to 400F, allowing the compound to be used under the most demanding applications.
    Applications:
    1. Precision finishing of all types of dies and molds.
    2. Polishing optical, ceramic and electronic components.

  2. U-based compounds (oil soluble) are less viscous that 'M' based compounds. Better flowability is suited for lapping and high-speed applications.
    Applications:
    1. Precision lapping of all types of dies and molds.
    2. Polishing optical, ceramic and electronic components.

  3. W-based compounds (water soluble) is offered specifically for the preparation of tools and dies which will be subsequently plated or coated. No thinner or solvents are required with W-based compounds. There is no impregnation by the compound into the substrate prior to coating.
    Applications:
    1. Polishing of tools and dies prior to Nitride coatings such as CVD and PVD.

Concentrations

Compounds, Paste and Slurries are available in light, medium, heavy, extra heavy and super heavy concentrations. The concentrations by carat weight are the highest available on the market.

Special Concentrations and Medias

Specially formulated concentrations are available for your special requirements in U, M or W base.

Applications:
  1. Specially formulated concentrations used in production lapping machines used to radius carbide inserts.
  2. Specially formulated concentrations used in edge preparation where very small radii are required with limited stock removal.
  3. Specially formulated concentrations used to ring gears for final fit prior to assembly in transmissions.
  4. Specially formulated Water Based Media where environmental concerns prevent the use of oil based products.

Thinners

Compound thinner specifically designed for thinning 'M' and 'U' based compounds. These thinner are excellent for keeping the lap moist and for efficient clean ups.

Packaging

Compound and Lapping Paste is available in standard 5 gram and 18 gram tubes or jars. Larger containers and dispensers are available upon request, such as 454-gram tubs (1 pound).

Thinner is available in 200cc, 500cc or 4 liter bottles.

Slurries is available in 500 gram, 1000 gram and 5000 gram containers.

www.adamaslab.com


Today's date: 7/30/2010
© 2001 DIANAMIC® Abrasive Products, Inc. All rights reserved.
2566 Industrial Row Drive -- Troy, Michigan 48084 USA
Telephone +248 280 1185 Facsimile + 248 280 2733
Toll Free in North America 1 888 DIANAMIC